Hello guys,
I was wondering when ground stitching 2 ground layers, what kinda pattern and spacing I should follow to place vias? and should I use more vias near components/pads that dissipate more heat?
As for shielding, Is it only used in RF boards or it doesn't matter!!
And if someone can give all cases where stitching and shielding can be used? I will be very thankful.
Thanks,
I was wondering when ground stitching 2 ground layers, what kinda pattern and spacing I should follow to place vias? and should I use more vias near components/pads that dissipate more heat?
As for shielding, Is it only used in RF boards or it doesn't matter!!
And if someone can give all cases where stitching and shielding can be used? I will be very thankful.
Thanks,