After watching some videos on grounds / return paths / shielding etc I came up with a design that I was wondering if someone could assist in assessing below simplified diagram with notes to see if it is a good grounding strategy also considering PCB EMI/EMC ?Simplified diagram attached.
Hello guys,
I was wondering when ground stitching 2 ground layers, what kinda pattern and spacing I should follow to place vias? and should I use more vias near components/pads that dissipate more heat?
As for shielding, Is it only used in RF boards or it doesn't matter!!
And if someone can...