I've done many 2-layer PCB designs with thru-hole components. I'm learning about designing for SMDA, and hoping to use a 4-layer board. I've read 2 articles on layer stackup, an AAC article here, and a Cadence article here.
My application is analog audio and a digital ESP32-S3-Touch-LCD. A guitar tuner called Q-tune, there's a manual link there too with schematic at the end if you're interested. 9v power in, two separate 5v regulators (one for the screen), one for a separate op amp. I've never been sure this was necessary, but separating the digital screen from the analog audio seemed best to keep the digital noise out of the audio signal.
Converting the 2-layer thru-hole board to a 4-layer SMD board, I need to determine the stackup order. The Cadence article suggests Signal-Ground-Power-Signal, I'm assuming the top and bottom would also have a ground plane. If so, I could have 9v, 5v-1 and 5v-2 in the power layer, and then audio on the top/bottom. But I've also got digital signals, the screen talking to relays, etc. So I need a separate ground layer or would the top/bottom ground plane be sufficient? What about:
Top: Analog signals
Inner1: Digital Signals
Inner2: Power
Bottom: Analog Signals
Suggestions?
My application is analog audio and a digital ESP32-S3-Touch-LCD. A guitar tuner called Q-tune, there's a manual link there too with schematic at the end if you're interested. 9v power in, two separate 5v regulators (one for the screen), one for a separate op amp. I've never been sure this was necessary, but separating the digital screen from the analog audio seemed best to keep the digital noise out of the audio signal.
Converting the 2-layer thru-hole board to a 4-layer SMD board, I need to determine the stackup order. The Cadence article suggests Signal-Ground-Power-Signal, I'm assuming the top and bottom would also have a ground plane. If so, I could have 9v, 5v-1 and 5v-2 in the power layer, and then audio on the top/bottom. But I've also got digital signals, the screen talking to relays, etc. So I need a separate ground layer or would the top/bottom ground plane be sufficient? What about:
Top: Analog signals
Inner1: Digital Signals
Inner2: Power
Bottom: Analog Signals
Suggestions?








