When you are wiring multiple buses such as encountered in microcontroller experimentation, breadboarding becomes painful.
There are three options (almost all obsolete) that I have used successfully in the past.
1) wire-wrapping, if you can locate wire-wrap DIP sockets
2) Scotch-3M IDC breadboarding system (I have to look up the correct terminology) - which is probably impossible to source. This, by far, is the most efficient breadboarding technique. You simple run wire-wrap wire to each connection point and press it in. It allows you to lay continuous runs of a signal wire.
3) Using special wire insulated with a thermo-plastic coating. You simply wire from point-to-point using your soldering iron. The heat from the soldering iron melts the plastic coating and solders the end of the wire to the solder pad. As above, you can lay continuous runs of one signal without having to cut the wire.
I can't find wire wrap sockets
is this any good? Using wires
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