Thermal compound or no thermal compound? That is the question.

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spinnaker

Joined Oct 29, 2009
7,835
You are correct! Looked closer at the heat sink and it is there. Thanks!

It is actually 3 strips. Any reason why they would apply it that way?
 

nsaspook

Joined Aug 27, 2009
7,356
You are correct! Looked closer at the heat sink and it is there. Thanks!

It is actually 3 strips. Any reason why they would apply it that way?
It gets thinner as it heats and spreads so smaller pads are spaced across the heat sink usually.

https://www.chomerics.com/techinfo/TestReports/t725_application_notes.pdf
T725 Pad Size Selection A T725 pad will soften and flow under the temperature and pressure conditions encountered in a typical application between a hot component and its heat sink. During the initial power cycle, as the T725 pad softens and flows to displace air in the interface gap the average thickness of the pad will decrease and the total area covered by the pad will increase. Because of this area change it is important that the initial pad size be smaller than the final desired size in the application to avoid excess material buildup along the edges of the heat sink/component assembly. A T725 pad will typically increase on the order of 30% in length and width, or about 60% in area. This 30% length/width increase was determined using a “generic” heat sink, its associated metal spring clip, and a microprocessor with a copper heat spreader in the center. The key goal is to at least cover the hot spot on the component.
 

Dr.killjoy

Joined Apr 28, 2013
1,196
Most times I remove the stock compound and replace with Artic Silver 5 for the best cooling performance..
Also cover the cpu with a really thin layer of thermal compound...
 
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