What is the preferred method of tacking down components in which one or more leads have had to be lifted from it's original pcb through hole ?
Physical stress consideration of original existing non lifted leads solder joints.
Preference to adhere component back down to PCB - where to apply the adhesive on the lifted component ?

Should you leave component lifted in the last soldering position or lay the component back down horizontally to the PCB ?
Preference in sealing compound or adhesive ( RTV, Epoxy, Plastic Bonding Epoxy, etc. )

Thanks for any suggestions.

 

Are you going to post a picture to help us understand what you're trying to describe?

 

I rarely have that problem, and the few times it has happened was when I was being too aggressive desoldering a TH device such as a TH header with 16 pins. I use a rivet to fix the problem. I do not trust trying to push the plated hole back into place and soldering to that.

 

I rarely have that problem, and the few times it has happened was when I was being too aggressive desoldering a TH device such as a TH header with 16 pins. I use a rivet to fix the problem. I do not trust trying to push the plated hole back into place and soldering to that.

My Original Post should have mentioned that the component is lifted due to a problem with the original circuit board trace or net. Therefore the remidy is to lift all component leads that exist in this the net. Next, softwire all these components leads together above the circuit board. Therefore, you are essentially you eliminate the original circuit traces I'm this net only.

 

Not much different than a Manhattan construction. There are some very neat examples on the web.

 

Pictures attached.
Their should be 3 photographs with a Through Hole type Resistor in the center of the pics with one lead lifted and wire soldered to thus lifted lead.
IF these pics will upload properly . . .

Thank you for your replies and suggestions.
More suggestions.