Solder not reaching hidden pads - solution?

Tesla23 said:

It's a bit hard to see from the picture, but the pad should extend past the end of the IC leg. Get some fine solder (e.g. 0.5mm dia) , so that you can place the solder across (and on) the pad at the end of the chip leg, pressing against the chip leg, and melt it there - it should wick up under the IC leg. The picture looks as if you are applying a largish amount of solder on top of the leg of the IC, and are simply getting a solder blob on top of the IC leg.

If this doesn't work, try tinning the pad leaving extra solder there, and reflow by heating each leg with the iron, This is not great as you really need some flux there when you remelt the solder. Paste is best if you are placing solder under the leg to reflow.

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