Solder composition questions

Thread Starter

tsmspace

Joined Mar 16, 2026
133
traditionally solder is 60/40 lead and tin. (60% lead 40% tin)

there are lead free solders that are 96.5% tin, 3% silver, 0.5% copper. (I was looking at weller solder, thinking about trying it out after having used my weller iron which my dad gifted me for the last year or so and having had such a great experience with it. Typically I was buying whatever cheapest iron, and the tips would dissolve into the solder after only a month or so. My weller iron has shown 0% visible degredation, and i've used up 1/2lb of 60/40 solder during that time)

I don't know if the solder would be improved using tin, or actually get worse. My rate of cold-joints is not that high, and generally I would attribute it to knowing when the pcb needs to be cleaned first, but just ignoring it and using lots of heat and time instead to make the joint. There have been some times, however, particularly with smt dip8 packages (like in those rdm5087 radio kits, or there are other larger ic's in kits like those little oscilloscopes) where looking at the joint it is perfect, and fits the description of how a good joint should look perfectly, yet it is not joined, and after desoldering the IC i can see that somehow it made a perfect fit over the pad, yet did not bond to the pad itself, and instead was bonded to some kind of ultra-thin invisible layer. I can usually see this because after removing the component, all of the other pads have solder still bonded to them, but the one pad is basically untouched. It looks new and never soldered to.

I did buy more 60/40 solder, and 1/2 pound, so unless I continue to buy endless little kits (unlikely as I feel I am approaching the end of that bender) I probably won't run out for years, but I am thinking I should try some other solder compositions to see if I learn something, or find that with some pcbs that are just hard to solder to with the 60/40, some kind of SnAgCu will actually be superior.

For anyone who wants to talk about the joints more than the solder, I often do not clean the pcbs, almost never, but I do use a flux paste often when doing the smt components, as i find it easier to keep the pads from bridging with my giant tip. I don't use liquid flux because although i have some, it's a much bigger mess. I don't have a nice bench, i basically sit on the floor in an oversized closet which is my room and work on the floor, and then I have to pack everything into some form of "going to tumble for sure" mishmash of stuff when putting it away, so I don't want opened bottles of liquid if I can avoid it. The paste does a good job of staying in the pack regardless of orientation or velocity of impact. I can't really solve my space issues. actually, cleanig the pcbs is also a case of storage, although i do have some isopropyl alcohol and occasionally use it when i just feel like it. It's a larger bottle and stores elsewhere standing on a shelf. Perhaps there is concern I will knock it over, but it's not like the small bottles of flux that are better stored in my kit than spread onto some unrelated shelf. So cleaning more is something I could do, but technically i have only one little kit that doesn't work right, and it does work intermittently, so my failure rate is very low, I'm really interested in discussing the differences in solder more than workflow, because I am aware of the workflow but do not know much about what to expect from other alloys of solder.

I have enough experience to see the value in semiconductor-factory quality workflow, though, so am still open to any discussion.

Anyway, here are the times when i have difficulty making a joint:

- solid core wire can sometimes be hard to join to, I think this is because the wire is so effective at sinking the heat away from the joint. In a separate conversation, I have spent some time wondering if solid-core wire would be more appropriate for many devices where stranded wire is used instead, as particularly with lighter gauges of stranded wire i have found the wires to break internally (and not associated with a solder joint, or at least not near the joint, although the stress of pulling on a single strand could still be leading to a break in the middle of the wire). I basically wonder if stranded wire is just generally more available being more appropriate more often, and therefore people just use it since it is easier to not buy even more types and guages of wire.

- some pcb materials, even brand new, even after cleaning, seem much more difficult to bond to. What I percieve as being "older style" acid-etched pcbs do seem more difficult to solder to, although I do not know if this is because of the amount of material that is in the trace is so much more thermally significant, that it sinks the heat away just like the wire. They do also appear to be a different metallurgical material than the materials in more modern style pcbs.

- smt components. Smt components are this unusual thing where it seems like nothing should be different but the size of the joint, yet somehow making good joints seems much more difficult. There is no logic here that makes sense for the heat being sinked away, because all of the traces, pads, and leads are so much smaller. These are the joints where I can see (with magnification and plenty of light) no sign at all of a bad joint, while it is reflowing these joints that will result in the device starting to work properly. With larger through-hole joints, the evidence of a bad joint is just more apparent, while with the smt smaller joints, I just feel like I can look at it for a very long time, with magnification, and see what should be a perfect joint, and then I can fix the device by redoing that joint. I can also see joints I have made that look clearly like bad joints, and then of course the device does not work, but with through-hole joints it rarely or never happens that a bad joint looks so perfect, while with smt it is basically very frequent.

I would love to hear more about whatever brands, but there are lots of posts talking about popular brands, I'm more interested in the alloys themselves, and presently am shopping the weller brand solder after my iron is so good, which is selling a lot of their lead-free tin-silver-copper.
 

MrChips

Joined Oct 2, 2009
34,948
No. 60/40 solder is not 60% lead and 40% tin. It is the other way around, 60% tin and 40% lead.

63/37 Sn/Pb is a eutectic which means that there is no transition phase. It goes from a liquid to a solid.

I buy Kester solder and no other brand.
 

Thread Starter

tsmspace

Joined Mar 16, 2026
133
No. 60/40 solder is not 60% lead and 40% tin. It is the other way around, 60% tin and 40% lead.

63/47 Sn/Pb is a eutectic which means that there is no transition phase. It goes from a liquid to a solid.

I buy Kester solder and no other brand.
Ok so let me see if I understand the logic of the 60/40 or other alloying elements.

The solder is really the tin , the tin melts at a low temperature and conducts electricity so then you can use the tin to make joints. But, the tin does not have the nice flow and bonding properties that would be desired when actually soldering, so the lead is added which makes the solder do things like make the good connection more easily, and make the nice shape of joints and do things like 'wetting' more easily and with less flux.
 

MrChips

Joined Oct 2, 2009
34,948
Ok so let me see if I understand the logic of the 60/40 or other alloying elements.

The solder is really the tin , the tin melts at a low temperature and conducts electricity so then you can use the tin to make joints. But, the tin does not have the nice flow and bonding properties that would be desired when actually soldering, so the lead is added which makes the solder do things like make the good connection more easily, and make the nice shape of joints and do things like 'wetting' more easily and with less flux.
No, no, no.

Sn/Pb solder is an alloy of two metals that melts at a relatively low temperature.
 

MrChips

Joined Oct 2, 2009
34,948
Yes.
Tin melts at 232°C.
Lead melts at 327°C
63/37 Sn/Pb solder melts at 183°C.

60/40 Sn/Pb solder has a wider melting point range, 183 to 191°C where it is in a slurry state.
This means that you have to hold the joint steady as it cools in order to avoid having a “cold solder“ joint.

You can create Sn/Pb alloy at any ratio you want to achieve different properties. For example, if you were making stained glass windows, you would want a different ratio.

I use 63/37 Sn/Pb Kester solder for all electrical and electronics work.
I have a small amount of silver solder that I use for jewelry work.
 

dl324

Joined Mar 30, 2015
18,403
The solder is really the tin , the tin melts at a low temperature and conducts electricity so then you can use the tin to make joints.
The melting temperature of tin is higher than 60/40 or 63/37.
But, the tin does not have the nice flow and bonding properties that would be desired when actually soldering, so the lead is added which makes the solder do things like make the good connection more easily, and make the nice shape of joints and do things like 'wetting' more easily and with less flux.
Solder used to be tin (or mostly tin with no lead) and it flowed and bonded just fine. They added lead due to a problem with tin whiskers. No lead solder brought back the tin whisker problem. NASA and the aviation industries are exempted from no lead required by RoHS (because tin whiskers can cause shorts).
but the 60/40 tin/lead is just a unique alloy with a particularly low melting temperature?
If you're having a problem with cold joints, switching to 63/37 should make the problem go away because it's eutectic and the melting temperature is lower than 60/40 solder. If you manage to get cold joints with 63/37, it's your technique.

If you're having a problem with wetting to traces, it's likely an issue with surface preparation. Flux and/or acetone should help with that.

If you're having problems soldering solid wire, it's either a temperature or tip problem.

You mentioned concerns with spilling liquids. I use smaller containers. For isopropyl alcohol, I use a small squeeze bottle or a pop-up dispenser. For liquid flux, I use a glue bottle with a metal nozzle.
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The bottles I use have a longer tip with a plastic sleeve.

1783134726617.png
 
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The properties of metal alloys can be rather different from the properties of any of the different elements, much as a cake is rather different from it's individual ingredients. This is indeed very fortunate.
 
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