Questions about doing reball and used devices

Hypatia's Protege

Joined Mar 1, 2015
3,228
I am talking about removing the chip and replacing it with new.
If we talk about notebooks...
What is your objective? Even assuming replacement compatibility, enhanced performance will not likely be attained in conjunction with existing support hardware/firmware (AKA 'glueware')...

Elaboration may be helpful:confused:

Best regards
HP:)
 

JUNELER

Joined Jul 13, 2015
183
Hi,
can you tell exactly what chip is that. microprocessor chip, support chip ics and many more....
In what particular areas or functions the chip located.
 

ErnieM

Joined Apr 24, 2011
8,415
I've done some balling ( first time on new devices) and rebelling, some 100 plus contacts. While I had preform arrays of balls I found better results by just placing individual balls onto the backside over a thin flux coating. The flux held them reasonably in place until the unit went thru a belt furnace for reflow. Surface tensin would get most balls dead center, occasionally two would merge needing a second trip thru the furnace after they were wicked up.

Reflowing the component back onto the board is specialty work needing a belt furnace under tight control.
 

Thread Starter

UnnamedUser159

Joined May 3, 2016
501
So.
i work in service.
The first thing i have on my mind is just removing the video chip from the notebook motherboard and then put it back.
Of course it will be better to replace the chip. I know that when the chip is replaced some services give 3 months warranty so i guess the effect is "not that bad"
I want to buy that machine for me, learn to do it well and apply it in future.
I just need recommendation for current one and to sit on my *ss and begin collecting money.

Thanks in advance
 
Top