Hi
I have a small issue and would like to know if this is a setting issue or a PCB fabrication issue/limitation. If it's PCB fabrication issue, how can we use their limitation in our design to avoid this small anomaly?
The issue I am having is solder mask(Green layer) sometimes does not cover the entire copper. I have a resistor R55 that is connected to GND, via a copper pour.
As you can see from the image, that design and 3cad shows a well edges solder mask, but when you look closely at the PCB you can see that it is slightly off on the bottom pad. Is this normal? Can it be rectified?
I have a small issue and would like to know if this is a setting issue or a PCB fabrication issue/limitation. If it's PCB fabrication issue, how can we use their limitation in our design to avoid this small anomaly?
The issue I am having is solder mask(Green layer) sometimes does not cover the entire copper. I have a resistor R55 that is connected to GND, via a copper pour.
As you can see from the image, that design and 3cad shows a well edges solder mask, but when you look closely at the PCB you can see that it is slightly off on the bottom pad. Is this normal? Can it be rectified?