Hi All,
I have 2 questions I hope you can help me with...
1) I have a 2 layer PCB (2.6" x 1.7") with 15 discrete SMT digital ICs. My first thought was to have the top layer be a ground pour and the bottom layer be VCC with vias through the board to power the chips. Does this make sense? Should both layers be ground? Are there EMI or capacitance issues with have the two layers be different signals?
2) I have an 8MHz clock shared by many of the chips on this board. Are there special concerns with routing this high frequency signal? Is it acceptable to pass this signal through vias? Should the trace width be minimized or maximized (currently 8 mil). Are there special considerations with branching the trace or avoiding sharp angles?
Thanks!
I have 2 questions I hope you can help me with...
1) I have a 2 layer PCB (2.6" x 1.7") with 15 discrete SMT digital ICs. My first thought was to have the top layer be a ground pour and the bottom layer be VCC with vias through the board to power the chips. Does this make sense? Should both layers be ground? Are there EMI or capacitance issues with have the two layers be different signals?
2) I have an 8MHz clock shared by many of the chips on this board. Are there special concerns with routing this high frequency signal? Is it acceptable to pass this signal through vias? Should the trace width be minimized or maximized (currently 8 mil). Are there special considerations with branching the trace or avoiding sharp angles?
Thanks!