Hello everyone,
I am designing a power supply board from a 72V battery pack using LT3958 (datasheet here) in SEPIC configuration. For SW node and GND connections, I used a copper pour without any thermals. This was because, when I used thermals the pour was not surrounding the pads. Is it safe to remove thermals from large pours? See attached pics for ref.
I am designing a power supply board from a 72V battery pack using LT3958 (datasheet here) in SEPIC configuration. For SW node and GND connections, I used a copper pour without any thermals. This was because, when I used thermals the pour was not surrounding the pads. Is it safe to remove thermals from large pours? See attached pics for ref.
Attachments
-
5.3 MB Views: 8
-
95.6 KB Views: 12