We have a component issue with MSL 3 where it is received without Moisture Barrier Bag and was exposed in very long period. Therefore, is there any way to save the affected component. The component is SMD LED.

 

Welcome to AAC.

A general guideline for MSL 3 would be something like an 8 hour bake at 125°C, but you should refer to the manufacturer’s specifications for handling. Of course, once you bake the components you will need to put them in an MBB with a desiccant for storage if they will not be used immediately.

 

The standard IPC/JEDEC J-STD-033 has some general baking conditions.

 

The standard IPC/JEDEC J-STD-033 has some general baking conditions.

Thanks for reply. Let me check it first. If anything, that I concerns, I will let you know.
By the way, here is the notes on the MBB for the LED.

 

Above image is the next batch received at our side.