Hello all,
Would like to get some help with this issues. My company is building this PCBA that has a couple of BGA on it. One BGA is having solder bridge issue, and another one keep having solder void. We are using Indium 6.6HF (lead free clean solder), running a Heller 1707 MK III series with 7 zones reflow oven. The stencil is .003 mil thick. Attach is the profile that we use. Any help/tip would great.
Thank you All
Would like to get some help with this issues. My company is building this PCBA that has a couple of BGA on it. One BGA is having solder bridge issue, and another one keep having solder void. We are using Indium 6.6HF (lead free clean solder), running a Heller 1707 MK III series with 7 zones reflow oven. The stencil is .003 mil thick. Attach is the profile that we use. Any help/tip would great.
Thank you All
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