I have worked on basic low speed PCBs and understand basics of the design methodologies for it.
But I am curious about the hi-speed PCBs like smartphone motherboards..
How are the components placed so close to make the PCB compact? How are the tracks routed in this tight spaces? What technologies are used here?
But I am curious about the hi-speed PCBs like smartphone motherboards..
How are the components placed so close to make the PCB compact? How are the tracks routed in this tight spaces? What technologies are used here?