Hi all,
I am using vias with thermal relief to connect the top and bottom ground planes together (design being done on Proteus)
Now I have the following concerns:
1) Is this a good method to use for connecting the top and bottom ground planes?
2) If I used these vias at different locations on the PCB (i.e. multiple points where the top and bottom planes are shorted), will this be bad practice?
Also, does anyone know how to cover these vias with solder mask? I managed to do this with all other vias, but for some reason, the vias being used to short the top anf bottom ground planes are not being covered by solder mask.
Any suggestions would be highly appreciated.
I am using vias with thermal relief to connect the top and bottom ground planes together (design being done on Proteus)
Now I have the following concerns:
1) Is this a good method to use for connecting the top and bottom ground planes?
2) If I used these vias at different locations on the PCB (i.e. multiple points where the top and bottom planes are shorted), will this be bad practice?
Also, does anyone know how to cover these vias with solder mask? I managed to do this with all other vias, but for some reason, the vias being used to short the top anf bottom ground planes are not being covered by solder mask.
Any suggestions would be highly appreciated.