I have a tiny chip, Si4744 with a QFN 24 footprint. There is no way to solder this to a breakout board by hand. I am looking for the best way to solder this to a breakout board that has copper pads that are not tinned.
Here's what I have
Si4744 Radio chip
QFN 24 -> DIP breakout board with no solder
Oven with accurate temperature sensors
Kester solder paste (really thick stuff)
I don't know a way to put the paste on the tiny pads without it filling in between the pads. Since the Si4740 pads seem to be tinned, I thought about trying to just put some flux on the board and heat it up to solder it without a paste. Balking on that because these chips are $23 apiece and I don't want to damage it.
Here is the datasheet for the chip
http://www.silabs.com/Support Documents/TechnicalDocs/Si4740-41-42-43-44-45.pdf
Here's the datasheet on the breakout board
http://www.chipquik.com/datasheets/PA0064.pdf
Ideas for doing this will be appreciated.
Here's what I have
Si4744 Radio chip
QFN 24 -> DIP breakout board with no solder
Oven with accurate temperature sensors
Kester solder paste (really thick stuff)
I don't know a way to put the paste on the tiny pads without it filling in between the pads. Since the Si4740 pads seem to be tinned, I thought about trying to just put some flux on the board and heat it up to solder it without a paste. Balking on that because these chips are $23 apiece and I don't want to damage it.
Here is the datasheet for the chip
http://www.silabs.com/Support Documents/TechnicalDocs/Si4740-41-42-43-44-45.pdf
Here's the datasheet on the breakout board
http://www.chipquik.com/datasheets/PA0064.pdf
Ideas for doing this will be appreciated.