So I was trying to replace the USB port on my Samsung Galaxy, but I ended up with several pads pulled up.
Trying to learn from the experience for next time.
It seems the solder was exceptionally "sticky". I've replaced USB ports before and this time the solder did not seem to want to melt. Instead it was what I would describe as very resistant to melt and sticky....hard to wick up, hard to clean, hard to melt. I started with a working temp around 340 but had to go to 440 because 340 didn't seem to do the trick. Even at 440 it was hard to get any flow.
Just wondering what I might have done differently?
Thanks
Trying to learn from the experience for next time.
It seems the solder was exceptionally "sticky". I've replaced USB ports before and this time the solder did not seem to want to melt. Instead it was what I would describe as very resistant to melt and sticky....hard to wick up, hard to clean, hard to melt. I started with a working temp around 340 but had to go to 440 because 340 didn't seem to do the trick. Even at 440 it was hard to get any flow.
Just wondering what I might have done differently?
Thanks