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RF Sputter or Copper sputtering

nsaspook

nsaspook

Joined Aug 27, 2009
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http://www.advanced-energy.com/upload/File/White_Papers/SL-WHITE17-270-01.pdf
http://www.advanced-energy.com/upload/file/white_papers/eng-white18-270-02.pdf

The plasma is normally at a positive potential (electrons have a higher thermal velocity) relative to any surface due to plasma electron loss with Capacitive RF drive systems. With a Inductive RF process reactor the sheath potentials in the plasma are usually lower. The impedance is a factor of Debye_length, the Plasma Sheath (their impedance will vary with the applied RF current) formed from that layer with a positive space charge, the physical dimensions (area, spacing) of the chamber, gas type, pressure, flow and many other factors. It's usually lower than a typical generator impedance of 50 ohms so a match that adjusts to chamber conditions will be needed

http://www.advanced-energy.com/upload/File/White_Papers/ENG-WHITE16-270-02.pdf
 
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