Hi guys.
I'm trying to design and understand how to make my first 4-layer PCB.
I was thinking of using this as a starting stackup:
· Signal
· Ground
· Power
· Ground
The PCB will be a small motor and inductor controller with a maximum load of about 2A, but it will also have I2C, SPI, and I2S digital signals, so there will also be analog signals.
However, I'm doubtful about the top layout, as the power plane is usually an inner layer, which limits heat dissipation, and I would like to have the power on the top layer. Is it possible to divide the PCB in two in this way: ¾ reserved for control signals divided into the 4 layers as described above (SIG/GND – PWR/GND) and the other ¼ into two layers. Top layer for 12V power and button layer for a dedicated ground plane? Any advice on this?
Regarding the ground planes, is it advisable to divide the 3 maximum ones distinctly, PGND, DGND, and AGND Or is it sufficient to have the maximum power and digital together and another ground reserved for analog signals?
I'm trying to design and understand how to make my first 4-layer PCB.
I was thinking of using this as a starting stackup:
· Signal
· Ground
· Power
· Ground
The PCB will be a small motor and inductor controller with a maximum load of about 2A, but it will also have I2C, SPI, and I2S digital signals, so there will also be analog signals.
However, I'm doubtful about the top layout, as the power plane is usually an inner layer, which limits heat dissipation, and I would like to have the power on the top layer. Is it possible to divide the PCB in two in this way: ¾ reserved for control signals divided into the 4 layers as described above (SIG/GND – PWR/GND) and the other ¼ into two layers. Top layer for 12V power and button layer for a dedicated ground plane? Any advice on this?
Regarding the ground planes, is it advisable to divide the 3 maximum ones distinctly, PGND, DGND, and AGND Or is it sufficient to have the maximum power and digital together and another ground reserved for analog signals?



