Hey guys,
I'm currently designing a new PCB using BSC100N06LS3GATMA1 mosfets. I want to connect them to power planes and my question is : should I use thermal relief or should I connect them directly to the plane? I've attached a picture where you guys can see the two options where on the lift side they are fully connected and on the right side they are connected through thermal reliefs.
How do I know why solutions is better? My concern is mainly regarding the soldering. I did not find any layout recommandations about this package.
Thank you very much !
I'm currently designing a new PCB using BSC100N06LS3GATMA1 mosfets. I want to connect them to power planes and my question is : should I use thermal relief or should I connect them directly to the plane? I've attached a picture where you guys can see the two options where on the lift side they are fully connected and on the right side they are connected through thermal reliefs.
How do I know why solutions is better? My concern is mainly regarding the soldering. I did not find any layout recommandations about this package.
Thank you very much !
Attachments
-
40.8 KB Views: 11