Hi,
I'm currently working on a board design for an EEG pre-amplifier (first draft posted here in case interested).
EEG is a very weak floating differential signal, about 20uV p-p and a source impedance of 5k at best. So I am using an instrumentation amplifier, with filters and bias return in front of this. I can get e.g. resistors with 0.1% tolerance without too much difficulty, capacitors is a bit harder.
But one thing that I was interested in was the idea of placing multiple lower-/higher-value passives in series/parallel to reduce the effective tolerances.
I have looked online and it seems (unsurprisingly) that the probability distributions of component values dpeend on the manufacturing process - with tighter tolerances we often see something like a Gaussian distribution; with maybe 5% or 10% tolerance it's not uncommon to see the middle section of a bell curve removed, where the manufacturer has chosen to extract those closer to the intended value and sold them as lower-tolerance, so we see the fringes around that corresponding to a normal distribution. And sometimes other distributions appear for yet more approaches as to how components are discarded or managed between batches.
However, if we assume a Gaussian distribution for now, N observations should improve the effective tolerance by a factor of √N, which should improve our CMRR. I.e. we could place five 1k 1% resistors instead of one 5k one and expect to be within 0.4% of the target value overall. The cost of this though is longer traces, more junctions/changes in material, and I would presume would overall worsen parasitics. For this project I have only laid my circuitboard very very roughly for the time being, whilst I am trying to get some feedback on the schematic - but to illustrate the idea, the below images contrast using literal values or by repeatedly placing the same lower-valued components to get the same equivalent:
I would hazard I guess placing extra components like this with the aim of improving matching would backfire and worsen my signal integrity overall - but my question is, can I quantify this without difficult maths or a lot of work?
PCB layout can be simulated, but this is pretty difficult just for the shape of the copper, and I'm not aware of any (at least widely available) simulators that also include the multiple different materials and 3D layouts involved. It would probably be highly dependent on heat and nearby signals too. Even if there's a rough analytic solution, I'm guessing the equations would be very complicated.
So, I'm wondering, does anyone who's laid out a lot more PCBs than me (this is my first!) have a rough idea or rule-of-thumb as to if this is a good idea or not? Are there any very rough ways to estimate parasitic effects to within one or two orders of magnitude, that I could then compare to the expected improvement in CMRR? Does this sound like a bad plan, or conversely, does this seem an okay approach to try out?
Thanks a lot!
I'm currently working on a board design for an EEG pre-amplifier (first draft posted here in case interested).
EEG is a very weak floating differential signal, about 20uV p-p and a source impedance of 5k at best. So I am using an instrumentation amplifier, with filters and bias return in front of this. I can get e.g. resistors with 0.1% tolerance without too much difficulty, capacitors is a bit harder.
But one thing that I was interested in was the idea of placing multiple lower-/higher-value passives in series/parallel to reduce the effective tolerances.
I have looked online and it seems (unsurprisingly) that the probability distributions of component values dpeend on the manufacturing process - with tighter tolerances we often see something like a Gaussian distribution; with maybe 5% or 10% tolerance it's not uncommon to see the middle section of a bell curve removed, where the manufacturer has chosen to extract those closer to the intended value and sold them as lower-tolerance, so we see the fringes around that corresponding to a normal distribution. And sometimes other distributions appear for yet more approaches as to how components are discarded or managed between batches.
However, if we assume a Gaussian distribution for now, N observations should improve the effective tolerance by a factor of √N, which should improve our CMRR. I.e. we could place five 1k 1% resistors instead of one 5k one and expect to be within 0.4% of the target value overall. The cost of this though is longer traces, more junctions/changes in material, and I would presume would overall worsen parasitics. For this project I have only laid my circuitboard very very roughly for the time being, whilst I am trying to get some feedback on the schematic - but to illustrate the idea, the below images contrast using literal values or by repeatedly placing the same lower-valued components to get the same equivalent:
I would hazard I guess placing extra components like this with the aim of improving matching would backfire and worsen my signal integrity overall - but my question is, can I quantify this without difficult maths or a lot of work?
PCB layout can be simulated, but this is pretty difficult just for the shape of the copper, and I'm not aware of any (at least widely available) simulators that also include the multiple different materials and 3D layouts involved. It would probably be highly dependent on heat and nearby signals too. Even if there's a rough analytic solution, I'm guessing the equations would be very complicated.
So, I'm wondering, does anyone who's laid out a lot more PCBs than me (this is my first!) have a rough idea or rule-of-thumb as to if this is a good idea or not? Are there any very rough ways to estimate parasitic effects to within one or two orders of magnitude, that I could then compare to the expected improvement in CMRR? Does this sound like a bad plan, or conversely, does this seem an okay approach to try out?
Thanks a lot!