Referring in particular to pages 23, 27 and 33 of the attached datasheet for isolated gate driver UCC 5390 S [from TI] to be used to power the high side gates of IGBTs in an H-Bridge module, is it correct that the 5V input to the VCC1 pin may be provided by an MCU [PVM], as suggested by the diagram on p.23?
Also, when interpreting such diagrams, does the symbol for ground mean that a common ground can be used; for example in the case of the 2 chassis grounds shown on the input side, can this be made common, and if so, how is this done: what is the chassis; is it just the laminate material on which components will be mounted?* Similarly, on the output side, can the other earth grounds be made common for the VCC2 and VEE2 pins, as is suggested in the text? *This is a practical problem: what material to use in order to mount the few necessary components.
Here I'm supposing that the split supply pins [OUTH, OUTL] connect directly to the Gate pin of the IGBT, and the VEE2 pin connects to the Source/Emitter pin of that IGBT; and that 15V will be supplied from an appropriate DC-source.
Also, when interpreting such diagrams, does the symbol for ground mean that a common ground can be used; for example in the case of the 2 chassis grounds shown on the input side, can this be made common, and if so, how is this done: what is the chassis; is it just the laminate material on which components will be mounted?* Similarly, on the output side, can the other earth grounds be made common for the VCC2 and VEE2 pins, as is suggested in the text? *This is a practical problem: what material to use in order to mount the few necessary components.
Here I'm supposing that the split supply pins [OUTH, OUTL] connect directly to the Gate pin of the IGBT, and the VEE2 pin connects to the Source/Emitter pin of that IGBT; and that 15V will be supplied from an appropriate DC-source.
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