We have a small PCB on which there are voltage regulators and MOSFET etc.
The bottom of the PCB is characterized to have 10 degC rise in temperature per W dissipation on the voltage regulators. The temperature can be measured by a temperature sensor mounted on the bottom of the PCB.
I am trying to do calculation for 10 W power dissipation with ambient temperature 40 degC.
Theoretically, the temperature at the bottom of the PCB will be 10 deg/W x 10 W + 40 degC = 100 degC. Please let me know if this calculation is correct.
The size of the exposed PCB where we can attach heat sink for a certain height is 2 cm x 2 cm.
The bottom of the PCB is characterized to have 10 degC rise in temperature per W dissipation on the voltage regulators. The temperature can be measured by a temperature sensor mounted on the bottom of the PCB.
I am trying to do calculation for 10 W power dissipation with ambient temperature 40 degC.
Theoretically, the temperature at the bottom of the PCB will be 10 deg/W x 10 W + 40 degC = 100 degC. Please let me know if this calculation is correct.
The size of the exposed PCB where we can attach heat sink for a certain height is 2 cm x 2 cm.
