I’ve been looking at thermal paste to heat sink two IC’s. But I would like it to be semi permanent. If I use thermal paste between the IC and heat sink with a tiny line of thermal glue on the two ends would this be ok. I thought that the paste would be more thermally conductive than the glue and the glue would add a semi permanent bond.

 

Thermal tape?
https://multimedia.3m.com/mws/media...onductive-interface-tapes-selection-guide.pdf

Thermal adhesive removal, test it first with a spare that's applied and cured.
Warm up the chip slightly, pure isopropyl applied with a Q-tip all around the gap, then use a razor blade to remove it off the chip and heat-sink.

 

The only drawback is tape isn’t as good as paste at thermal conductivity.

 

The only drawback is tape isn’t as good as paste at thermal conductivity.

That's your problem wanting a semi permanent bond. It's not a drawback, it's a specification. Your half paste and glue idea is tailored to your specification.