Sorry I did not know of a better way to word that title.
But, I am curious about a simple design decision. In the first image the left component(diode)'s bottom pin is routed through the left components bottom pin. In the second image the bottom left pad and bottom right pad converge on the trace they will be sharing.

I know they are theoretically electrically the same but I am unsure of how it matters in practice. I have read some articles that mostly mention that this matters for wave soldering and one may cause more of an issue than the other. These components(diode and resistor) are attached to a MOSFET gate on the bottom side and attached to a gate driver on the top side. I am mostly concerned about issues with signal integrity but any information on this subject would be useful for me.
thank you.

ps I could obvious do the same "splitting" to the top trace but didn't think to show that as well when I was taking the photos.

 

Personally
I'd prefer the right version,
I'm old, and still worry about the dreaded flux trap.
The track looks fairly thick, does it need to be that large,
it "could" be considered to "wick" the solder away from the pad,

But in truth, I'd not worry.

 

Electrically, it should not matter.
There are situations with thu-hole components when I prefer not to route through a pad. Same applies to SMD.
This would allow me to isolate a component by cutting the trace if I had some debugging and rerouting to do.


There are those occasions when I would choose B and not A.

 

I agree that track width seems excessive. It's almost the size of the pad itself. Unless you have through hole components on the board, the most popular soldering process for surface mount is reflow soldering. If the board has solder mask, either way should be no problem.

 

Sorry I did not know of a better way to word that title.
But, I am curious about a simple design decision. In the first image the left component(diode)'s bottom pin is routed through the left components bottom pin. In the second image the bottom left pad and bottom right pad converge on the trace they will be sharing.

I know they are theoretically electrically the same but I am unsure of how it matters in practice. I have read some articles that mostly mention that this matters for wave soldering and one may cause more of an issue than the other. These components(diode and resistor) are attached to a MOSFET gate on the bottom side and attached to a gate driver on the top side. I am mostly concerned about issues with signal integrity but any information on this subject would be useful for me.
thank you.

ps I could obvious do the same "splitting" to the top trace but didn't think to show that as well when I was taking the photos.

To be perfectly honest, the left image causes a 'T' intersection that can cause EMF. it's better to connect to the pad on the right. While the right image has a 90-degree corner, it's better than a 'T'. IMHO.

 

Hi jlawley1969,

Top 5 PCB Design Guidelines Every PCB Designer Needs to Know – PCB HERO (pcb-hero.com)

Take a look at point 2. It shows an example about the possibility of the components being misplaced during the soldering. Both images could be problematic from this perspective.