Hello all,

I was soldering an SMD component and I accidentally used a higher temperature and airflow to solder it so I burnt the PCB and a bubble appeared around the area as seen in the image below.


Is this bad? will this issue affect the functionality of the PCB?
What can I do to fix this?

Thanks,

 

It’s not good, but if it is a single or double sided board, it will probably have survived as there are no tracks in the vicinity of the bubble.
A multilayer board might not have fared so well.

 

Is this bad?

Definitely not a good thing to do.

will this issue affect the functionality of the PCB?

If you didn't damage any traces/components, you've likely impacted reliability.

What can I do to fix this?

You can't repair the heat damage to the board. Next time, use your eyes and nose to avoid applying excessive heat.

 

It’s not good, but if it is a single or double sided board, it will probably have survived as there are no tracks in the vicinity of the bubble.
A multilayer board might not have fared so well.

It is probably a 4 or 6 layer but I can see that the area affected has nothing beneath it .. no traces no copper fils ..
So I hope the bubble doesn't spread .. can it btw!?
I have used a tweezer to pop the bubble ! I don't know if thats good or not !