Hi
I traditional have all ways used via with a size 0.6mm with 0.3mm for all my pads and connections.
When it comes to connected a copper pour to either VCC layer or GND layer, is it better to use less via but slightly large in size or to use much more via but smaller in size?
Does it make a difference?
My PCB requires various stitching from a plane layers(VCC or GND) to TOP or Bottom layer?
I traditional have all ways used via with a size 0.6mm with 0.3mm for all my pads and connections.
When it comes to connected a copper pour to either VCC layer or GND layer, is it better to use less via but slightly large in size or to use much more via but smaller in size?
Does it make a difference?
My PCB requires various stitching from a plane layers(VCC or GND) to TOP or Bottom layer?