We are thinking to use ultrasonic cleaning for PCB assemblies, SMD 2 sides with some through hole.
1. Is Ultrasonic cleaning recommended for PCB assemblies with built-in oscillator ICs & crystal, electro magnetic relays?
2. Does the Ultrasonic cleaning affect on the component & IC chip bonding?
Mods Note:
Please don't hijack other member's thread, now you have you own.
This thread was split from Hi Watt, British Army, Electronics wiring by hand without pcb.
1. Is Ultrasonic cleaning recommended for PCB assemblies with built-in oscillator ICs & crystal, electro magnetic relays?
2. Does the Ultrasonic cleaning affect on the component & IC chip bonding?
Mods Note:
Please don't hijack other member's thread, now you have you own.
This thread was split from Hi Watt, British Army, Electronics wiring by hand without pcb.
Last edited by a moderator:
