Hello, I am new on this forum, and I have a very specific question about mounting DPAK/IPAK mosfets. I am mounting them on a perf board so I am considering soldering separate copper pads 15mm x 15mm in size which is smaller than the recommended area of 6cm^2 to achieve 50K/W. However, they are much thicker (0,5mm). Since calculations in the datasheet are given for a standard PCB copper thickness (2oz?) which is probably like 10 times thinner than what I have, my question is this: for a fixed copper pad area, is there a linear dependence between thickness and the resulting thermal resistance? Basically, instead of 6cm^2 at 0.07mm I have about 2cm^2 at 0.5mm. What will be the RthJA in this case? Thanks for any insight.