I have some questions on 4 Layer stackups. I have been watching videos of Altium Academy and rick Hartley and they have suggested that an ideal 4 layer stack up is 1. ground
2. traces/power plane
3. traces/power
4. ground
Now I've been using this stack up and trying to build my first mid sized PCB (70 -80 components) and have come across some questions:
1. Because I have less space around my IC pads for via some of my via traces are long. These are referenced to the power plane underneath, now when I take my take my signal from lets say layer 1 to layer 2 the trace reference changes from power to ground. Is this a major issue and if it is how should I mitigate this? (via in pad maybe?)
2. traces/power plane
3. traces/power
4. ground
Now I've been using this stack up and trying to build my first mid sized PCB (70 -80 components) and have come across some questions:
1. Because I have less space around my IC pads for via some of my via traces are long. These are referenced to the power plane underneath, now when I take my take my signal from lets say layer 1 to layer 2 the trace reference changes from power to ground. Is this a major issue and if it is how should I mitigate this? (via in pad maybe?)
