Hello, I am trying to implement the following driver schematics based on an article I got.
the problm is that it has two amplifier which are basickly come from one chip.
In reality I got the following this situtation , Where 0805 is very big to it.
I can try 0402 components .what is the routing strategy you reccomend for effectivly making this driver schematics.

 

Hello, I am trying to implement the following driver schematics based on an article I got.
the problm is that it has two amplifier which are basickly come from one chip.
In reality I got the following this situtation , Where 0805 is very big to it.
I can try 0402 components .what is the routing strategy you reccomend for effectivly making this driver schematics.
View attachment 350463
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You haven't shown R12 on your schematic so it's difficult to say. The demo board (DC261A) design files include a BOM which suggests 0.1W (0603) for most resistors except output (1W as it can drive 5000mA into the load). The demo board also includes KiCad Gerbers which should aid in any board layout.

 

The main rules are don't run any output signals close to the inputs, and make traces as short as possible..
Generally that means the component is rotated to achieve that.

 

Something else to think about when picking part size is if you are hand assembling, 0603's are going to be harder to place and solder than 0805's. If you need to change values or something like that, you will get a couple more cycles with the larger pads and parts before damaging the PCB potentially. Almost anything smaller than 0603's like 0402's is going to take a good hand and microscope to place and solder. I have done boards for 35 years and used 0201's on designs and am Soooooo glad I don't have to place and solder them to a board. We/I typically use 0603's as the smallest for most designs and 0805's and 1206's for everything else if we can. It's Aerospace stuff and reliability is the rule for quality designs. For hobby and home projects, bigger is easier and sometimes better for re-working a design.
As Crutschow mentioned, keep low level signals like inputs away from the power outputs and try to ensure signal returns are not running in the same routes. For audio frequencies its not as critical but it's just good practice. Good Luck and have fun...

 

Hello,Given the datasheet below what is the difference between LT1795CSW and LT1795ISW.
In the photo below they have two names next to the same shape . What it the difference?
Thanks.

https://www.digikey.com/en/products/detail/analog-devices-inc/LT1795CSW-PBF/890941
https://www.analog.com/media/en/technical-documentation/data-sheets/1795fa.pdf

 

they have two names next to the same shape . What it the difference?

The data sheet will tell you.

 

I understand the difference between FE package and S package but here next to each photo we have other two names.
LT1795CSW and LT1795ISW
I cant see in the data sheet the reason why we have two names next to each photo.

 

I understand the difference between FE package and S package but here next to each photo we have other two names.
LT1795CSW and LT1795ISW
I cant see in the data sheet the reason why we have two names next to each photo.

Note 3: The LT1795C is guaranteed to meet specified performance from 0°C to 70°C and is designed, characterized and expected to meet these extended temperature limits, but is not tested at –40°C and 85°C. The LT1795I is guaranteed to meet the extended temperature limits.

Consumer.
Industrial.

 

Its temperature issue thanks I understand

 

Its temperature issue thanks I understand

View attachment 351645

They all come from the same wafer, the I models are just tested so you can include the data in the build docs for customers that need it.

 

Since that device is a stereo power amplifier there is probably some sort of heat sink required that we are not told about. ALSO, because it is a power amplifier of some kind, the resistance of all of the connecting traces matters a great deal.