Hello,
I am designing a 12V / 5V 3A buck converter board based on LM2596-ADJ.
To cool the LM2596, I added via holes connected to the ground.
During a DRC test, an Overlap error is generated on these holes, although they are connected to the ground, just like the substrate. Will it cause production problems?
To improve ground contact, I added vias.
There is also an idea to add cooling through holes for the diode, but there is not much space between the contacts.
I ask you to evaluate the wiring of the board, to indicate possible weak points.
If necessary, Gerber files in the attachment.
Thank you!
I am designing a 12V / 5V 3A buck converter board based on LM2596-ADJ.
To cool the LM2596, I added via holes connected to the ground.
During a DRC test, an Overlap error is generated on these holes, although they are connected to the ground, just like the substrate. Will it cause production problems?
To improve ground contact, I added vias.
There is also an idea to add cooling through holes for the diode, but there is not much space between the contacts.
I ask you to evaluate the wiring of the board, to indicate possible weak points.
If necessary, Gerber files in the attachment.
Thank you!
