Hi

I belive this process is used for soldering thru-hole connectors in SMD process. Guidelines For Paste-In-Hole Reflow Processing - The Samtec Blog

Has anyone got experience with what needs to be done on PCB stencil to place the correct amount of paste for a thro-hole connector?

Do we need to place solder paste slightly outside of the connector solder pad?

I would like to solder 2.54mm pin headers.

Thanks

 

You may need really "giant" pads, maybe accompanied by a stencil "thicker-than-normal".
Another option might be to dispense some solder directly into the holes.
And no - our own series production has massively protested against attempts to use "pin in paste" (that's how it is also called) - they never got it right during the last 2 decades.
Is your question about series production ?

 

Thank You for your reply, Yes we are going to have this design done in production. We do our own assembly, and was looking to a process to avoid manual soldering for connectors.

 

Thank You for your reply, Yes we are going to have this design done in production. We do our own assembly, and was looking to a process to avoid manual soldering for connectors.

Our production resorted to robotized selective soldering (multiple pins at a time) resp. a soldering robot (single pin soldering).

Samtec's page doesn't give much information and Bob Willis' ebook about PIHR (linked by samtec) seems to be no longer available, but I could dig up another document that looks quite detailed:
https://smtnet.com/library/files/upload/Pin-in-paste-stencil-design.pdf
So good luck with that - PIHR is quite tricky