So I was trying to take off the 64GB NAND off of the iPhone 6 Plus logic board but I pulled it off too quick where I eventually peeled off I beleive to be the black lacquer and black underfill. Plus I splotched solder all over the exposed grounded area. How can I fix this mess lol Thanks

http://imgur.com/I9TTCOj

http://imgur.com/97V3rhZ

http://imgur.com/UrBWklb

 

Got $300?
https://support.apple.com/iphone/repair/other

 

Got $300?
https://support.apple.com/iphone/repair/other

<Discourteous remark removed by moderator. Remember that user agreement to which we all agreed?

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It was my way of saying that, with my modest soldering skills and the known difficulty of board-level iPhone repairs, I'd have no other options. I'll be very curious to hear how your project goes.

 

Thanks for the lame advice that's not gonna get me anywhere. "NEXT"

How exactly is that advice lame? Do you mean to imply that it can be done for less? I think that is a fanciful notion.

 

I learned micro/miniature board repair in the military.
It takes lots of skills and a host of very expensive equipment.
You will not be able to repair the phone with some simple instructions from an Internet forum.
Any forum.
You can however make it unrepairable quite easily.

 

He could buy the necessary equipment to effect repairs, but, that 300 dollars will be a way cheaper price to pay.

Even with the proper equipment, he still is likely to render the phone inoperable while overcoming the learning curve on microminiature repairs.

I wish him luck.