So I was trying to take off the 64GB NAND off of the iPhone 6 Plus logic board but I pulled it off too quick where I eventually peeled off I beleive to be the black lacquer and black underfill. Plus I splotched solder all over the exposed grounded area. How can I fix this mess lol Thanks
http://imgur.com/I9TTCOj
http://imgur.com/97V3rhZ
http://imgur.com/UrBWklb
http://imgur.com/I9TTCOj
http://imgur.com/97V3rhZ
http://imgur.com/UrBWklb