Hi, we are having a bit of an debate on a very specific issue in reading a MIL-883 requirement. Maby someone experienced can help. We are looking at the section on "Visual inspection of passive elements". There is one paragraph saying blistering is not acceptable in metallization and the debate is whether that requirement is also valid for via holes? Or since via hole defects are specified separately, it does not. Anyone have input?

 

hi Helena,
Welcome to AAC.
Is this link any help?
E

Clip:
Key Criteria for Blistering (Method 2009.9)
When reviewing the document for via hole blisters, look for the following rejection criteria:

Solder/Lead Blistering: Solder columns, spheres, or terminations that exhibit peeling, flaking, or blistering are cause for rejection.
Surface Bubbles/Blisters: Open bubbles in glass seals or plating that exceed 5 mils (for certain packages) or 10 mils (for TO-5 headers) are not permitted.
Subsurface Bubbles: Large bubbles or voids in the sealing area that exceed 1/3 of the area, or bubbles that bridge more than 2/3 of the distance between the lead and package wall, are prohibited.

https://www.google.com/search?q=how+to+read+mil-883+spec+for+via+hole+blistering&client=firefox-b-d&hs=kzNp&sca_esv=a34c10a8172aea8d&sxsrf=ANbL-n5004P8JLQQ9fbACLF4extkWl3TjQ:1771583331741&ei=YzeYacyBLYmchbIP3rmVyAg&biw=1239&bih=763&ved=0ahUKEwiMv7aZ7ueSAxUJTkEAHd5cBYkQ4dUDCBM&uact=5&oq=how+to+read+mil-883+spec+for+via+hole+blistering&gs_lp=Egxnd3Mtd2l6LXNlcnAiMGhvdyB0byByZWFkIG1pbC04ODMgc3BlYyBmb3IgdmlhIGhvbGUgYmxpc3RlcmluZzIIEAAYogQYiQUyBRAAGO8FMgUQABjvBTIIEAAYogQYiQUyBRAAGO8FSOslUNULWJQYcAF4AZABAJgBdqAB4wKqAQMzLjG4AQPIAQD4AQGYAgWgAogDwgIKEAAYsAMY1gQYR5gDAIgGAZAGCJIHAzQuMaAHkBCyBwMzLjG4B_oCwgcHMC4xLjMuMcgHFoAIAA&sclient=gws-wiz-serp

Added:
https://www.tjgreenllc.com/2016/09/...ternal Visual Inspection of Passive Elements).

 

Hi, no not quite since the question is on how to read a specific method (2032.4-Visual inspection of passive elements) and what are if section 3.1.1.3 is valid also for vias or only planar metallization since section 3.1.1.6 that specifically mentions "metalized through hole defects" exists it could be read as only section 3.1.1.6 is valid for vias.

 

I'm familiar with IPC-A-610 rev G but not with MIL-883. Can you post a link to your specs? I'd like to look for some qualifiers to see if there's a subsection you need to refer to.

When I worked for Northrop Grumman Space Technologies, we could receive a piece of material that is governed by one spec. Within that spec it could refer to a secondary spec. The secondary can refer to a third, leading to a fourth spec. Only after diving that deep could we determine a product met spec. No job is finished until the paperwork gets done.

 

If there is a question about interpreting that specification, AND IF it is a project where it is actually important, THEN probably most of the folks here do not have the certifications to sign-off on an interpretation. I have an OPINION, but not any certificates to prove the required authority to provide an interpretation. So while some can provide a correct answer, the certification paper trail is the challenge. GOOD LUCK!!