No, the internal connections of the mosfet 'die' are limited by there physical size. I had a link that I can't find now (from when I first started this quest to learn electronics) that gave total ratings for different mosfet 'packages'. The only link I can find now for you is this one;When you say that, are you referring to using them with no heat sink? I was planning on using a hefty heat sink an possibly a fan; would that change anything? looks like the guy in my previous link (using massive heat sink) got away with using them (well he got about 750A out of 10 paralleled before they blew). he was using a different MOSFET but same package.
http://mcmanis.com/chuck/robotics/projects/esc2/FET-power.html