I am designing a PCB Layout for a variable frequency motor drive. It runs from a 100Vdc input and max 30A per phase output. It's a simple 6-mosfet layout using the internal diodes.
My thoughts were to have two filled areas on the top layer for the +Vdc and -Vdc connections. Planning to split the top layer in two and just have two large rectangular pours for this purpose. Planning to do something similar for the bottom layer except splitting it into three large rectangular pours for each phase. This leaves me thinking that the gate drive connections and shunt measurement Kelvin connections can be routed in two internal layers. Is this wise? I was thinking of keeping the power traces to the outer layers for better heat radiation but it does mean I'll have vias all over the place for the signal connections
Also, I'm planning on using isolated gate drivers and transformer isolated power supplies. Also, I'll be using isolated error amplifiers for the current sensing. If I go with my proposed layout I'll have to position these components relatively far away from the power traces. Is this good practice?
My thoughts were to have two filled areas on the top layer for the +Vdc and -Vdc connections. Planning to split the top layer in two and just have two large rectangular pours for this purpose. Planning to do something similar for the bottom layer except splitting it into three large rectangular pours for each phase. This leaves me thinking that the gate drive connections and shunt measurement Kelvin connections can be routed in two internal layers. Is this wise? I was thinking of keeping the power traces to the outer layers for better heat radiation but it does mean I'll have vias all over the place for the signal connections
Also, I'm planning on using isolated gate drivers and transformer isolated power supplies. Also, I'll be using isolated error amplifiers for the current sensing. If I go with my proposed layout I'll have to position these components relatively far away from the power traces. Is this good practice?