Hi,
I am new to the PCB design game and I have a somewhat general question. If you have a multi-layer board as follows:
Layer 1: Misc
Layer 2: Component A Power/signal
Layer 3: Component A RTN Ground Plane
Layer 4: Sensor Power RTN
Layer 5: Sensor signals/Sensor power
Layers 6-8: Misc
If I am expecting a 5A (increase with respect to DC operation) transient pulse with a rise time of 100 ns to 1 microsecond in Layer 2, can the return current in layer 3 electromagnetically couple on to my sensor ground (layer 4) and thereby, induce ground noise? If so, aside from moving the sensor planes to different layers, are there other ways to mitigate this issue? Thanks in advance for any information or help. If chatting is something that would be better to help answer this question, I am most definitely open to chat with anyone who graciously offers a few minutes of their time!
I am new to the PCB design game and I have a somewhat general question. If you have a multi-layer board as follows:
Layer 1: Misc
Layer 2: Component A Power/signal
Layer 3: Component A RTN Ground Plane
Layer 4: Sensor Power RTN
Layer 5: Sensor signals/Sensor power
Layers 6-8: Misc
If I am expecting a 5A (increase with respect to DC operation) transient pulse with a rise time of 100 ns to 1 microsecond in Layer 2, can the return current in layer 3 electromagnetically couple on to my sensor ground (layer 4) and thereby, induce ground noise? If so, aside from moving the sensor planes to different layers, are there other ways to mitigate this issue? Thanks in advance for any information or help. If chatting is something that would be better to help answer this question, I am most definitely open to chat with anyone who graciously offers a few minutes of their time!