Dear all!! Thank you for your concern.
I have a product design like this, and I wonder what is the name and function of the rigid Au plating design on this product.
Thank you for your support.

 

Is this a guessing game?
I have no idea what it is, because you gave us no clues like:
What the product is.
The size of what you are showing us.
Whether it is part of a circuit board or just decoration.
Where in the product it is located.

 

Thank you for your comment. I will add these detail in my question

 

This is TEPBGA ( thermally enhanced plastic ball grid array). this product belongs to package type ( it is type of PCB with smaller size). The size of whold product is: 32mm * 32 mm for the whole product and the size for the part that I asked for ( die attached areas) is about: 10mm*10 mm. Thank you for your help.

 

This is TEPBGA

This question is beyond most of us. We deal with the connections of the balls to our PCB.
There should be some information from the makers of the FPGA.

 

This question is beyond most of us. We deal with the connections of the balls to our PCB.
There should be some information from the makers of the FPGA.

Thank you for your answer. Have a nice day

 

Dear all!! Thank you for your concern.
I have a product design like this, and I wonder what is the name and function of the rigid Au plating design on this product.
Thank you for your support. View attachment 356258

Where did that image come from? It's impossible, for me, to tell what is real and what has been overlaid on top of it.

What is the package part number or or at least a fuller description of it.

My guess is that at least some of what is there is related to the thermal enhancement to conduct heat away from the IC and up to the thermal mating surface of the package. Some of it might also be power/ground plane hardening.

 

Is that a real picture? The point you marked in the picture seems like to be used as Power or GND. I cant give you more information without a fuller description of it, or a more clear pictuer.

 

This is TEPBGA ( thermally enhanced plastic ball grid array). this product belongs to package type ( it is type of PCB with smaller size). The size of whold product is: 32mm * 32 mm for the whole product and the size for the part that I asked for ( die attached areas) is about: 10mm*10 mm. Thank you for your help.
View attachment 356310

yeah, those are internal heat spreaders. but i am not designing ICs so i never care about the internal structure. the only thing that matters to me is how IC interfaces to the PCB.

https://www.nxp.com/docs/en/application-note/AN5126.pdf

 

The "gold color" on a PCB that gets a BGA reflow solder attached was called "Gold Flash" when I was involved with PCB creation. I never got closer than reading that on the PCB company literature because I never did BGAs nor reflow soldering on any of our creations.

 

i don't think question has anything to do with creating PCBs, it is about internal structure of the IC. from what i read they are used to distribute heat and serve as bus bars for power terminals (one such bar can be connected to several IC pins as well as spots on the die)