Running into some trouble re-mounting some FETs onto a heat sink in a power inverter. Originally the FETs were secured onto a heat sink using thermal conductive tape in between. When I reassembled, I did away with the tape and just used thermal compound. When I put everything back together, and connected the power up, the inverter overload buzzer went off and unit failed to operate. I took it apart and removed the FETs from the heat sink reconnected the inverter with it open and the inverter worked just fine. To double check, I remounted the FETs again as before, and the buzzer went off again.
Is it normal for transistors of this type to require isolation like this when being mounted? I thought the manufacturer used the tape perhaps cause it was a less messy option than the compound, but it seems I'm wrong.
Is it normal for transistors of this type to require isolation like this when being mounted? I thought the manufacturer used the tape perhaps cause it was a less messy option than the compound, but it seems I'm wrong.