My first attempt at making a capacitive touch PCB. I followed the guidelines from Microchip's Application Note.
The PCB will be overlayed with 2mm thick glass.
My questions:
The LEDs are reverse mounted, but in the 3D model there is no hole on the touch pads. Do I have to manually drill holes?
Can I place the connection header in the space between two touch pads(back layer )? Since it is a through hole component I am afraid it will cause issues with touch detection.
Thanks.
The PCB will be overlayed with 2mm thick glass.
My questions:
The LEDs are reverse mounted, but in the 3D model there is no hole on the touch pads. Do I have to manually drill holes?
Can I place the connection header in the space between two touch pads(back layer )? Since it is a through hole component I am afraid it will cause issues with touch detection.
Thanks.