How do you measure the capacitance of a bondpad? I know it doesn't really matter as much for digital but its important when dealing with RF. I Googled but got a lot of patents
Thanks in advance.
Thanks in advance.
Now I just have to figure out how to model it. I have a boards with space for a few MEMs devices but there are only the pads there now. I just wanted to know if it was possible to do something in the lab to measure the capacitance.You will need to model it to extract the C-parasitics at the pad. Industry would use something like Ansoft's Q3D Extractor to model the device and extract the C (and R and L if you like) parasitics by placing a sink and source around the bondpad contact. The simulator would then electrically model the bond pad behaviour according to the source/sink arrangement. If you assume uniform source and sink area across the bond pad you will get the pure-C of the bond pad.
It is very difficult to empirically measure the RLC parasitics of bond pads because of the negligible small values of these elements. I did quite a lot of work of these some years back.
Dave
No its not raw chip die pads. It is a small board that has 3 bondpads on it. Similar to the bondpads in this picture but only 3.Just curious, are you talking raw chip die pads?
by Jake Hertz
by Duane Benson
by Jake Hertz
by Duane Benson