I'm designing a compact RF module with a fine-pitch BGA.
Thinking of using via-in-pad for space reasons, especially since some PCB manufacturers now offers it for free.
Are there any performance or DFM issues I should watch out for?
Thinking of using via-in-pad for space reasons, especially since some PCB manufacturers now offers it for free.
Are there any performance or DFM issues I should watch out for?