Hi there,
I'm just getting in to SMD and my first project is to convert a RF circuit i made with through hole components.

I've found SMD counterparts for everything but the filmcaps. I read those few available in SMD won't survive the reflow owen, so it seems one is stuck using only ceramics. Is that right?

Can't imagine a world without filmcaps.

 

Here are nearly 3000 Surface Mount Film Capacitors.
This datasheet displays the reflow temperatures required.
http://www.mouser.com/Passive-Components/Capacitors/Film-Capacitors/_/N-9x371?P=1z0z7ym

 

Yep, been on Mouser too, as well as reading the datasheets. There is still a lot of people saying these parts don't survive the owen though.
Was hoping for someone to prove these statements wrong.

 

Do those people have any verifiable data to support their assertions? For example temperature charts and failure mode analysis? Can you post an example here?

John

 

Well, there´s different kinds of ovens. Some have conveyors and temperature profile settings, and some are a toaster oven with a guy trying to judge when the board is ready. The former should have no trouble with the caps, the latter will probably melt them.

 

I read

a lot of people saying

That just isn't enough basis to come to a conclusion on this site. These guys are pros. They require hard facts because they won't speculate at the risk of looking foolish.

 

Ok, sorry.
Let me change my question to - Are anyone using SMD filmcaps in their production using reflow soldering?

It's a lot of money to gamble on when doing a production, so any experience on this would be appreciated.