Hi, I have seen some FPGA boards in which they have 10 layers stackup that ends up to 1.6 mm thickness of the PCB. I don't think more than 10 layers are possible with 1.6 mm thickness. However, for bigger FPGA PCB designs, normally 16 layers or even 22 layers is recommended if there are many peripherals and have other components with BGA packages.

What are the advantages or disadvantages of PCB thickness if we compare 2.4 mm with1.6 mm PCB thickness.

 

Hi, I have seen some FPGA boards in which they have 10 layers stackup that ends up to 1.6 mm thickness of the PCB. I don't think more than 10 layers are possible with 1.6 mm thickness. However, for bigger FPGA PCB designs, normally 16 layers or even 22 layers is recommended if there are many peripherals and have other components with BGA packages.

What are the advantages or disadvantages of PCB thickness if we compare 2.4 mm with1.6 mm PCB thickness.

Hi,
First of all, higher layer count may cause inter layer registration problems
Furthermore, thicker board poses a limitation on via diameters, since it is a question if aspect ratio. The higher the aspect ratio, expect higher difficulty in via plating uniformity and higher susceptibility to z axis expansion.