Dear Members of the forum, my name is Lorenzo and I am a new member of the Forum. Nice to meet you!
I have made a small, dual layer and circular PCB designed in order to be placed beneath a stack of 3 LR44 coin cell batteries. Its size is slightly bigger than the LR44 dimension.
On the upper side and in the center of the PCB, there is just a pad in order to guarantee the electrical connection with the coin cell. On the lower side of the PCB there is an MCU and few passive components.
According to your experience, do you think that its close position to the coin cells and/or the high density of the components underneath would be a roadblock for the PCB market/production? Would this kind of design pass the required certifications?
Thanks for any suggestion.
I have made a small, dual layer and circular PCB designed in order to be placed beneath a stack of 3 LR44 coin cell batteries. Its size is slightly bigger than the LR44 dimension.
On the upper side and in the center of the PCB, there is just a pad in order to guarantee the electrical connection with the coin cell. On the lower side of the PCB there is an MCU and few passive components.
According to your experience, do you think that its close position to the coin cells and/or the high density of the components underneath would be a roadblock for the PCB market/production? Would this kind of design pass the required certifications?
Thanks for any suggestion.