I apolozie for this, is there any nicer way in order to better this layout? Since I am still experimenting with component I kept my circuit to breadboard level for ease of changing anything.

No need to apologize, you're the one with the problem. In RF development we use Manhattan style "dead-bug" construction similar to what was mentioned by @crutschow in post #15. The reason is that RF circuits just won't work at all if we used solderless breadboards like you did. It is appropriate for some things, but as you have discovered, not for what you are trying to do. In RF development it is not uncommon to have a wastebasket full of discarded breadboards. Our technicians were very efficient at building new ones in short order.

 

hi Hiril,
If you plan a multi module project, it is wiser and less painful to build and test one module.
Using this method, you should have a reference/datum point for completing/testing the remainder of the modules for the project.

Build a single model using good construction techniques that represent the final overall build.

Post your single model results.

E

@Hiril Patel Viel Glück mit dem Projekt

 

No need to apologize, you're the one with the problem. In RF development we use Manhattan style "dead-bug" construction similar to what was mentioned by @crutschow in post #15. The reason is that RF circuits just won't work at all if we used solderless breadboards like you did. It is appropriate for some things, but as you have discovered, not for what you are trying to do. In RF development it is not uncommon to have a wastebasket full of discarded breadboards. Our technicians were very efficient at building new ones in short order.

Wow, i have never seen such way of design before but definitly will be more compact then mine. Will research more on this nad see how can I apply for my cirucit. thank you.

 

hi Hiril,
If you plan a multi module project, it is wiser and less painful to build and test one module.
Using this method, you should have a reference/datum point for completing/testing the remainder of the modules for the project.

Build a single model using good construction techniques that represent the final overall build.

Post your single model results.

E

Ok, I will get to the lab tommorw and post single module results. Is it fine If I do these on breadboard? since I am using single components here

 

Hi Hiral,
For this type of low noise design, I would not recommend using bread board construction.

You could try using Vero type copper strip board 0.1 inch hole pitch and soldered components.
E

 

Hi Hiral,
For this type of low noise design, I would not recommend using bread board construction.

You could try using Vero type copper strip board 0.1 inch hole pitch and soldered components.
E

Ok I will order it and post results in few days

 

h Hiral,
There is inadequate power rail decoupling, also it appears the power line and Ground commons appear Daisy-chained.
Any chance of a photograph of the project.
E

Can you please advice me on that?

 

You will not make any improvements with solderless breadboards.
For best results you need to move forward and assemble all your circuits on double sided copper clad boards.

Pay attention to wiring, ground planes, and power supply decoupling.

 

Hi Hiril,
Check this link for decoupling techniques.
E
https://www.analog.com/media/en/training-seminars/tutorials/MT-101.pdf

 

And another thing. Use separate feed lines of power to analog and digital circuits.

Use LC or RC filters on analog supply rails.

Use separate ground planes for analog and digital circuits.

 

hi Hiril,
Also check this video link.
E