Hi guys!
We're a project team from the institute of Entrepreneurship & Innovation at the Vienna University of Economics and Business and we're looking for your help in finding new application fields for a novel technology called direct laser soldering (DLS). The technology has been developed and is currently being used at the European Organization for Nuclear Research (CERN) for silicon pixel detectors (Large Hadron Collider).
some of the advantages:
+ minimize insensitive areas / minimal interconnection areas necessary
+ assemblies which cannot tolerate large temperature variations
+ assemblies with complex shapes
+ silicon chips can be directly mounted to flex PCB without further packaging
+ high quality mechanical and electrical connection (no glue required)
+ chips in mosaic patterns can easily be replaced
+ low cost
Our goal is to evaluate further fields of application for this technology in order to bring a high value to a broad range of people and make this existing technology applicable for other users as well.
Do you guys have any ideas where this technology could be used as well? (which Industries? which problems could be solved (or not)? how do we get to potential users? who might be interested as well?)
Thanks for your time!
Your information is an important contribution to the success of our project!
best regards
We're a project team from the institute of Entrepreneurship & Innovation at the Vienna University of Economics and Business and we're looking for your help in finding new application fields for a novel technology called direct laser soldering (DLS). The technology has been developed and is currently being used at the European Organization for Nuclear Research (CERN) for silicon pixel detectors (Large Hadron Collider).
some of the advantages:
+ minimize insensitive areas / minimal interconnection areas necessary
+ assemblies which cannot tolerate large temperature variations
+ assemblies with complex shapes
+ silicon chips can be directly mounted to flex PCB without further packaging
+ high quality mechanical and electrical connection (no glue required)
+ chips in mosaic patterns can easily be replaced
+ low cost
The technology discussed by the project team is denoted as Direct Laser Soldering (DLS) which constitutes a novel interconnection technology for chips and flexible printed circuits (FPC). The current industry standard is wirebonding which connects integrated circuits with its packaging by means of copper or gold wiring. While wirebonding is the most cost-effective interconnection technology there are certain fields of application which cannot be served by it.
Direct laser soldering can be used for many of these applications. The technology enables the user to minimize insensitive areas and provides a solution where minimal interconnection areas are necessary. It can also be used for assemblies which cannot tolerate large temperature variations during assembly as well as for assemblies with complex shapes.
Furthermore silicon chips can be directly mounted to flex PCB without further packaging. The DLS was developed and is currently being used at the European Organization for Nuclear Research (CERN). The main field of application will be a new tracking system at the ALICE-Project in which the entire silicon tracker will be replaced by a monolithic-pixel tracker system.
Our goal is to evaluate further fields of application for this technology in order to bring a high value to a broad range of people and make this existing technology applicable for other users as well.
Do you guys have any ideas where this technology could be used as well? (which Industries? which problems could be solved (or not)? how do we get to potential users? who might be interested as well?)
Thanks for your time!
Your information is an important contribution to the success of our project!
best regards